JPS5977715A - チツプ状圧電振動部品 - Google Patents
チツプ状圧電振動部品Info
- Publication number
- JPS5977715A JPS5977715A JP18887882A JP18887882A JPS5977715A JP S5977715 A JPS5977715 A JP S5977715A JP 18887882 A JP18887882 A JP 18887882A JP 18887882 A JP18887882 A JP 18887882A JP S5977715 A JPS5977715 A JP S5977715A
- Authority
- JP
- Japan
- Prior art keywords
- insulator
- electrode
- piezoelectric
- conductive film
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012212 insulator Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims description 25
- 230000005284 excitation Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000004020 conductor Substances 0.000 abstract description 2
- 238000010030 laminating Methods 0.000 abstract 1
- 230000010355 oscillation Effects 0.000 abstract 1
- 238000000605 extraction Methods 0.000 description 28
- 239000000463 material Substances 0.000 description 23
- 238000010897 surface acoustic wave method Methods 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 11
- 239000000919 ceramic Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 241000723353 Chrysanthemum Species 0.000 description 2
- 235000007516 Chrysanthemum Nutrition 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 101000905241 Mus musculus Heart- and neural crest derivatives-expressed protein 1 Proteins 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18887882A JPS5977715A (ja) | 1982-10-26 | 1982-10-26 | チツプ状圧電振動部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18887882A JPS5977715A (ja) | 1982-10-26 | 1982-10-26 | チツプ状圧電振動部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5977715A true JPS5977715A (ja) | 1984-05-04 |
| JPH0155609B2 JPH0155609B2 (en]) | 1989-11-27 |
Family
ID=16231455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18887882A Granted JPS5977715A (ja) | 1982-10-26 | 1982-10-26 | チツプ状圧電振動部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5977715A (en]) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228123U (en]) * | 1988-08-12 | 1990-02-23 | ||
| JPH0265517A (ja) * | 1988-08-31 | 1990-03-06 | Murata Mfg Co Ltd | 圧電振動子 |
| JPH0257621U (en]) * | 1988-10-20 | 1990-04-25 | ||
| JPH02116126U (en]) * | 1989-03-02 | 1990-09-18 | ||
| JPH033842U (en]) * | 1989-06-02 | 1991-01-16 | ||
| JPH033839U (en]) * | 1989-06-02 | 1991-01-16 | ||
| JPH0412712U (en]) * | 1990-05-23 | 1992-01-31 | ||
| US5170303A (en) * | 1990-04-30 | 1992-12-08 | Seagate Technology Inc. | Inductive thin film head having improved readback characteristics |
| US5237235A (en) * | 1991-09-30 | 1993-08-17 | Motorola, Inc. | Surface acoustic wave device package |
| US5382929A (en) * | 1992-07-31 | 1995-01-17 | Ndk, Nihon Dempa Kogyo Company, Ltd. | Monolithic crystal filter |
| US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
| JP2006148758A (ja) * | 2004-11-24 | 2006-06-08 | Kyocera Kinseki Corp | 水晶振動子パッケージ |
-
1982
- 1982-10-26 JP JP18887882A patent/JPS5977715A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0228123U (en]) * | 1988-08-12 | 1990-02-23 | ||
| JPH0265517A (ja) * | 1988-08-31 | 1990-03-06 | Murata Mfg Co Ltd | 圧電振動子 |
| JPH0257621U (en]) * | 1988-10-20 | 1990-04-25 | ||
| JPH02116126U (en]) * | 1989-03-02 | 1990-09-18 | ||
| JPH033842U (en]) * | 1989-06-02 | 1991-01-16 | ||
| JPH033839U (en]) * | 1989-06-02 | 1991-01-16 | ||
| USRE35228E (en) * | 1990-04-30 | 1996-05-07 | Seagate Technology, Inc. | Inductive thin film head having improved readback characteristics |
| US5170303A (en) * | 1990-04-30 | 1992-12-08 | Seagate Technology Inc. | Inductive thin film head having improved readback characteristics |
| JPH0412712U (en]) * | 1990-05-23 | 1992-01-31 | ||
| US5237235A (en) * | 1991-09-30 | 1993-08-17 | Motorola, Inc. | Surface acoustic wave device package |
| US5382929A (en) * | 1992-07-31 | 1995-01-17 | Ndk, Nihon Dempa Kogyo Company, Ltd. | Monolithic crystal filter |
| US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
| JP2006148758A (ja) * | 2004-11-24 | 2006-06-08 | Kyocera Kinseki Corp | 水晶振動子パッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155609B2 (en]) | 1989-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4737742A (en) | Unit carrying surface acoustic wave devices | |
| US4736128A (en) | Surface acoustic wave device | |
| JPS5977715A (ja) | チツプ状圧電振動部品 | |
| JPH05315885A (ja) | チップ型発振子およびこの発振子を用いた発振回路 | |
| JPH03220911A (ja) | 弾性表面波フィルタ | |
| JPS58138115A (ja) | チップ状圧電振動部品の製造方法 | |
| JPS58197909A (ja) | チツプ状圧電振動部品の実装構造 | |
| JPH0155605B2 (en]) | ||
| JP2003087075A (ja) | 高周波回路部品 | |
| JPH0155606B2 (en]) | ||
| JPH0244167B2 (en]) | ||
| JPS59119911A (ja) | 圧電振動子 | |
| JPS58139517A (ja) | チツプ状圧電振動部品 | |
| JPS62122311A (ja) | コンデンサ内蔵形圧電共振子 | |
| JP3063066B2 (ja) | 表面実装型電子部品 | |
| JPH0155608B2 (en]) | ||
| JPS6012811A (ja) | 圧電振動部品 | |
| JPS62122312A (ja) | コンデンサ内蔵形圧電共振子 | |
| JPH0155607B2 (en]) | ||
| EP0821482A2 (en) | Piezoelectric resonator and electric component using the same | |
| JP2001189237A (ja) | 容量素子 | |
| JPH03249812A (ja) | 電子部品 | |
| JP2611552B2 (ja) | 圧電部品 | |
| JPH03165613A (ja) | 圧電部品 | |
| JPS63217814A (ja) | チツプ状電子部品 |